Sensor IC Substrate uses Shengyi SI10U material, which has excellent heat and moisture resistance, good PCB processability, and low CTE and high modulus, which can effectively reduce the warpage of Sensor IC Substrate.

Component Substrate PCB selection of the substrate material should first consider the electrical characteristics of the substrate material, that is, the insulation resistance of the substrate, arc resistance and breakdown strength; secondly, to consider its mechanical properties, that is, the shear strength and hardness of the printed circuit board.

USB 3.0 delivers data rates of up to 5Gbps, 10x faster than high-speed USB 2.0, and optimized for power efficiency.

LGA literally means grid array package, which replaces the previous pin pins with a metal contact package.

A distinct advantage of EMMC is the integration of a controller in a package that provides a standard interface and management memory; EMMC is the most popular local storage solution for mobile devices today.

IC substrate PCB is mainly used in light-weight, light-weight and powerful electronic products, such as smart phones, notebook computers, tablet computers and networks. such as telecommunications. medical treatment. industrial control. aerospace and military fields.

On the same function, the SIP module integrates a variety of chips, which can save PCB space compared to individually packaged IC.

High density structure: hole-filling plating and stacked hole structure

Low coefficient of thermal expansion and high modulus for effective warpage reduction of the encapsulation carrier

Double-sided printed circuit board is widely used in high-tech industries, such as: telecommunications, power supply, computer, industrial control, digital products, scientific and educational equipment, medical equipment, automotive, aerospace, etc.

Aluminum substrates are widely used in LED lamps and lanterns, hybrid integrated circuits, automobiles, office automation, high-power electrical equipment, power supply equipment, etc. They have excellent heat dissipation, good machinability, dimensional stability and electrical properties.

Aluminum substrates are widely used in LED lamps and lanterns, hybrid integrated circuits, automobiles, office automation, high-power electrical equipment, power supply equipment, etc. They have excellent heat dissipation, good machinability, dimensional stability and electrical properties.